Welcome to the Singapore Symposium on INTERCONNECT RELIABILITY

Welcome to the Second Symposium on Interconnect Reliability at NATIONAL UNIVERSITY OF SINGAPORE. The enhanced reliability of chip and package interface in flexible, bendable, and wearable advanced electronic products is becoming a necessity with the inevitable integrated demands of Tsensors and IoT. Chip and solder-centric Interconnects with tighter pitches, higher volumes, and lower costs have been a constant challenge for the micro bonding landscape. The RoHS directive was updated in July 2011 as RoHS 2 , and although it did not restrict any additional materials, the directive provided deadlines for some exempted applications unless a technical reason was provided for continuing the exemp-tion. In particular, the RoHS 2 directive required medical devices and monitoring and control instruments to comply with cur-rent RoHS restrictions by July 2014 and industrial control and monitoring instruments to comply by July 2017. For all other equipment, unless explicitly excluded, compliance is required by July 2019. The electrical and electronic equipment explicitly excluded were equipment used in military and space applications, large-scale stationary industrial tools, large-scale fixed instal-lations, implantable medical devices, transportation applications (except for electric two-wheel vehicles), non-road mobile ma-chinery, photovoltaic panels designed for permanent use, and equipment designed solely for the purpose of research and devel-opment . The use of high melting temperature–type solders (i.e., lead-based alloys containing 85% or more lead by weight) re-mained exempt in the RoHS 2 directive for all applications. However, since all exemptions are bound to expire at some point in the near future, the electronics industry will need to continually evaluate the options if the exemptions are to expire. Further-more, today there are numerous types of lead-free solders that are being developed and investigated for next generation applications. This second symposium provides an overview of the technology trends, and development challenges in methods, materials and applications in the Interface Technology engineering arena with special emphasis on upcoming technologies for electronic cluster industries. The primary purpose of this symposium is to bring together the surface and interface engineering professionals at interconnect arena , and end users from Asia and ASEAN for R&D/business collaboration opportunities in YOUR SINGAPORE.

Gopala KRISHNAN PhD,

Department of Physics,
National University of Singapore.
Email: phyrgk@nus.edu.sg
 

Prof Michael PECHT

Director, CALCE
University of Maryland, USA.

Prof Cher Ming TAN,

Director, CReST
Chang Gung University, Taiwan.

A/P Eng Soon TOK

Department of Physics,
National University of Singapore.